MSI لوحة ام B860 جيمنج بلس واي فاي، ايه تي اكس – تدعم معالجات انتل كور الترا (سلسلة 2)، LGA 1851 – ذاكرة DDR5 بوست 8600+ MT/s (OC)، منفذ PCIe 5.0 × 16 × 16، M.2 الجيل الخامس، انتل كيلر 5G LAN، واي فاي
ر.س1,049.00
Supports the latest Intel Core Ultra Processors (Series 2) and uses a 12 Duet Rail Power System (P-PAK) VRM for the Intel B860 chipset with Core Boost architecture
Excellent cooling properties such as 7W/mK MOSFET thermal pads, additional choke thermal pads and an extended heat sink; includes chipset heatsink, EZ M.2 Shield Frozr II, a combo header for pump & system fan (3A)
Storage options include 1 x M.2 Gen5 x4 128Gbps slot with EZ M.2 Shield Frozr II to prevent thermal throttling, 1 x M.2 Gen4 x4 64Gbps slot and 1 x M.2 Gen4 x2 32Gbps slot
B860 GAMING PLUS WIFI: Win the Competition The B860 GAMING PLUS WIFI motherboard is developed based on the Intel B860 chipset (Intel Core Ultra processors (Series 2), LGA 1851) and offers first-class GPU support with a PCIe 5.0 x16 slot, improved DDR5 memory support (8 GAMING PLUS 8). 600+ MT/s OC) and extensive M.2 (Gen5 and Gen4) storage options with EZ M.2 Shield Frozr II. To power Intel Core Ultra processors (Series 2), the B860 GAMING PLUS WIFI is equipped with a 12 Duet Rail Power System (P-PAK) VRM for the CPU and 8+4-pin CPU power connectors, complemented by several passive cooling functions. The B860 GAMING PLUS WIFI motherboard features a durable 6-layer server-grade PCB and an all-new SMT soldering technology (Surface Mount Technology) that improves signal quality. Connectivity features include Wi-Fi 7 and Bluetooth 5.4 at full speed, Intel Killer 5G LAN, Thunderbolt 4, 4K/60Hz display support and 7.1 HD audio. For gamers looking for a platform with Intel Core Ultra processors (Series 2) that combines PCIe 5.0 x16 graphics card architecture, enhanced DDR5 memory support, Thunderbolt 4 solution and M.2 Gen5 storage options in a sleek design, the B860 GAMING PLUS WIFI Gaming Motherboard is the perfect choice.
Supports the latest Intel Core Ultra Processors (Series 2) and uses a 12 Duet Rail Power System (P-PAK) VRM for the Intel B860 chipset with Core Boost architecture
Excellent cooling properties such as 7W/mK MOSFET thermal pads, additional choke thermal pads and an extended heat sink; includes chipset heatsink, EZ M.2 Shield Frozr II, a combo header for pump & system fan (3A)
Storage options include 1 x M.2 Gen5 x4 128Gbps slot with EZ M.2 Shield Frozr II to prevent thermal throttling, 1 x M.2 Gen4 x4 64Gbps slot and 1 x M.2 Gen4 x2 32Gbps slot
Specification: MSI لوحة ام B860 جيمنج بلس واي فاي، ايه تي اكس – تدعم معالجات انتل كور الترا (سلسلة 2)، LGA 1851 – ذاكرة DDR5 بوست 8600+ MT/s (OC)، منفذ PCIe 5.0 × 16 × 16، M.2 الجيل الخامس، انتل كيلر 5G LAN، واي فاي
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ر.س1,049.00
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